| 摘要 |
PROBLEM TO BE SOLVED: To provide a noise suppression structure capable of suppressing a conductive noise and a radiation noise and being reduced in thickness, to provide a multilayer printed circuit board, and to provide a method for easily manufacturing the multilayer printed circuit board. SOLUTION: The noise suppression structure 10 includes: a first conductor 11; a noise suppression layer 12 to be electromagnetically connected to the conductor 11 via an insulating layer 13; and a second conductor 14 opposing to the layer 12 via the insulating layer 13, and the noise suppression layer 12 is the layer with the thickness of 5-300nm which is obtained by physically evaporating a metallic material onto the insulating layer 13. The multilayer printed circuit board includes the noise suppression structure. The method for manufacturing the multilayer printed circuit board includes: a process for removing a part of the first conductor of the noise suppression structure by etching; and a process for removing a part of the insulating layer between the first conductor and the noise suppression layer and a part of the noise suppression layer by etching with the first conductor as a mask. COPYRIGHT: (C)2007,JPO&INPIT |
