| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method which can perform joining even at a low joining temperature or causes no problem even at a high joining temperature. SOLUTION: In the invented method, a wire 1 is placed on an electrode 2, and a jointing material 4 is mounted thereon. The jointing material 4 is heated up to a first temperature so that an insulating coating 12 dissolves and liquates out. When the jointing material 4 is further heated up to a second temperature higher than the first temperature, jointing metal in the jointing material 4 melts, and the jointing material 4 is separated into a jointing metal layer 41 and an insulating coating layer 42 because of difference in affinity. When heating is continued, thermosetting resin hardens so that a hard resin layer (hardened layer) 42 is formed so as to cover the metal layer 41. COPYRIGHT: (C)2007,JPO&INPIT |
