| 摘要 |
An electronic component module (27i) is provided with a ceramic substrate and a plurality of bonding material applying lands (3). The ceramic substrate has a rear face (27a) that is rectangular. The plurality of bonding material applying lands (3) are arranged on the rear face (27a). The plurality of bonding material applying lands (3) include outer peripheral land rows (4), each of which is arranged in a line along each side of the rear face (27a) with the exception of corner portions (7) of the rear face (27a). The plurality of bonding material applying lands (3) include corner portion inner lands (5), each of which is arranged on the rear face (27a) at a position that is shifted inwardly in a substantially diagonal direction from the corner portion (7) and is adjacent to the bonding material applying lands (3) closest to the corner portion (7) at ends of the outer peripheral land rows (4) that are arranged in lines along two sides that are connected by the corner portion (7). |
