| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead free bump, which is a spherical-ring shape whose upper portion has a recess structure, and a semiconductor device having the bump, in which the bump is formed in a reflow heat treatment condition (peak 245°C) of a general-purpose lead-free soldering after being printed and applied to an electrode, and the formed bump does not melt in the reflow heat treatment condition below peak 300°C, and the shape is not a hemispheric shape having an electrode surface in the bottom portion. SOLUTION: The paste for forming the bump includes a flux consisting of rosin, an activator, solvent and thickener, and a conductive filler consisting of a mixture of first metal particles and second metal particles. COPYRIGHT: (C)2009,JPO&INPIT |
