| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ultrasonic bonding fixture capable of efficiently and easily connecting a conductive member to an electrode of a semiconductor device using ultrasonic. <P>SOLUTION: An ultrasonic-bond fixture 15 which directly ultrasonic-bonds a conductive current path member 6 to an electrode member 4 formed in an upper surface of a semiconductor device 5 has: a contact end surface 15a for contacting the current path member 6 to give supersonic vibration to the current path member 6; and a suction hole 16 for sucking the current path member 6 to support the current path member 6 against the contact end surface 15a. <P>COPYRIGHT: (C)2007,JPO&INPIT |
