| 摘要 |
A semiconductor package includes a base plate; a sidewall provided at a periphery of the base plate; a sensor chip retained in a chip accommodation space defined by the sidewall; and a chip installation hole provided in the base plate for installing the sensor chip. The sensor chip is disposed in the chip installation hole provided in the base plate of the case. Accordingly, it is possible to reduce a thickness of the semiconductor package without changing a thickness of the sensor chip. The base plate has a relatively large thickness except for the chip installation hole. Accordingly, even when the semiconductor package is made thinner, rigidity of the base plate is maintained, thereby minimizing a strain in the base plate.
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