| 摘要 |
A stacked-type semiconductor device including a plurality of semiconductor elements stacked through a spacer is disclosed. The electrical characteristics with the bonding wires are improved and a narrow pitch is secured. The stacked-type semiconductor device includes a lower semiconductor element (2) fixed on a wiring board (1), an insulating spacer (4) fixed on the lower semiconductor element (2), a grounded spacer (10) fixed on the insulating spacer (4) and having a grounding conductor film formed on a part or the whole of the upper surface thereof, an upper semiconductor element (5) fixed on the grounded spacer (10), bonding wires (3, 6, 12) for electrically connecting between the lower semiconductor element (2) and the wiring board (1), between the upper semiconductor element (5) and the wiring board (1) and between the grounding conductor film of the grounded spacer (10) and the grounding terminal of the wiring board (1), respectively, and a seal resin (7) for sealing the bonding wires. |
