| 摘要 |
1,185,857. Electric couplings. SIGNETICS CORP. 15 Aug., 1967 [16 Aug., 1966; 27 Feb., 1967], No. 37486/67. Heading H2E. [Also in Division H1] In an integrated circuit assembly a semiconductor chip or die 11 (Figs. 9, 10) has printed circuit leads 14 on one face and terminating in contact pads 16, which pads on assembly are soldered or welded to ends 33a of printed circuit connecting elements 33 on a rigid plastics member 31. The chip is then encapsulated to the member 31 by a plastics block 36 (Fig. 10). The member 31 is then laid on a printed circuit board 41 so that the chip lies in a recess 46 and the connecting elements 33 engage a printed circuit pattern 43, to which they are subsequently bonded by soldering or welding. The assembly is then encapsulated in plastics 48. There may be a plurality of chip assemblies on one circuit board. In another embodiment (Fig. 2, not shown) the chip is connected and bonded to a pattern of free-standing metal leads by thin film connecting elements on a flexible plastics sheet, the free standing leads being subsequently bent downwards to form connecting pins and the assembly encapsulated as Fig. 8. |
