| 发明名称 |
Thick film structures of precise dimensions - for integrated circuits |
| 摘要 |
A ceramic substrate is fitted with a film of photo-polymer (suitably Riston RTM), followed by a photo-lithographical preparation of recesses which are then filled with a thick film paste, (suitably platinum-gold paste 8048 RTM). Firing the latter at the same time removes the photopolymer. |
| 申请公布号 |
DE1915756(A1) |
申请公布日期 |
1970.10.01 |
| 申请号 |
DE19691915756 |
申请日期 |
1969.03.27 |
| 申请人 |
SIEMENS AG |
发明人 |
BEIL,MARTIN;ROSSHAUPTER,ERICH;WEITZE,ARTUR |
| 分类号 |
H01L21/70;H05K1/09;H05K3/12 |
主分类号 |
H01L21/70 |
| 代理机构 |
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代理人 |
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