| 摘要 |
PURPOSE: A cap for a package step of a semiconductor laser diode is provided, which can improve the S/N ratio noise characteristics of a laser diode by stabilizing the characteristics of the device. CONSTITUTION: A header(300) is formed to be projected on a center part of a stem(200), and a laser diode(100) is attached to a front facet of the header and radiates a laser beam. A cap(400) is adhered and covered to the top of the stem, and a mirror(170) is formed on the top of the mirror and reflects a light fed back from the external. The first connection pin(700) is connected with the laser diode through a wire bonding, and the second connection pin(800) is connected electrically with the laser diode through a groove of the stem. The mirror is formed with a thin metal film below 10nm.
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