发明名称 |
APPARATUS FOR ALIGNING WAFER FOR SEMICONDUCTOR FABRICATION |
摘要 |
PURPOSE: An apparatus for aligning a wafer for semiconductor fabrication is provided to handle a loading position of the wafer to the horizontal direction by using a loading position handling member. CONSTITUTION: A wafer(110) is loaded on a plurality of alignment pins(120). A motor is used for rotating the alignment pins(120). A rotary shaft transmits power to a lower portion of the alignment pins(120). A sensor(150) is installed at a side of the alignment pins(120). The sensor(150) is formed with a light emitting portion(151) and a light receiving portion(152). A loading position handling member(200) is installed at the outside of the alignment pins(120). A through-hole(240) is formed in a housing(210). A plurality of guide projections(220) are formed at an upper side of the housing(210). An elevation driving portion(160) is formed at a lower portion of the housing(210). The housing(210) has an incline plane(230).
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申请公布号 |
KR20020083278(A) |
申请公布日期 |
2002.11.02 |
申请号 |
KR20010022715 |
申请日期 |
2001.04.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MUN, GWANG IL |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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