| 摘要 |
A sputtering system includes a pair of spaced electrodes, one formed from titanium and the other formed from platinum. Substrates are rotated over both electrodes by a turntable that is actuated by a reversible drive mechanism. A mask alternately blocks each electrode. The mask is coupled to the turntable drive mechanism by a slip clutch and is moved between the two blocking positions when the direction of rotation of the turntable is reversed. In the use of the system, the electrodes are actuated in sequence. The mask is positioned to block each electrode during the initial portion of its operation. This deposits the material of the electrodes on the mask until the electrodes are clean.
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