| 摘要 |
1350782 Semiconductor devices WESTING- HOUSE ELECTRIC CORP 19 April 1971 [6 March 1970] 23592/71 Heading H1K A thin film FET is fabricated on a rigid (Fig. 4) or flexible metallic or non-metallic substrate 10 on which an insulant layer 12 of alumina, insulant resin, epoxy resin, or anodization of metal substrate, is deposited and overlain by a spacer layer 16 of etchable or soluble material, e.g. polymethyl methacrylate, NaCl, Cu, Al, or polystyrene. A layer of metal 18 insoluble in the foregoing solvents or etchants, e.g. Au, Pt, T 1 , or Cu is deposited on the spacer, and on it is formed a photoresist layer 20 on which is printed and developed a slot and pad pattern after which the developed portion is removed to define slot 22 and pads 23, 25, 27 (Fig. 5), enabling corresponding openings to be etched in layer 18 and etched or dissolved in spacer 16 to expose the insulant 12. The structure is enclosed in a vacuum chamber, and a source electrode 32 of Au, Ag, Al or Ni is vapor deposited from source 30 (Fig. 6) angularly disposed from the vertical on exposed layer 24. A drain electrode 34 is similarly deposited from opposedly angled source 36. After blanking out pad areas 23, 25 by mechanical masks, a semiconductor layer 40 of, e.g. Te, Cd, S, Si, CdSe InAs, GaAs, SnO 2, PbTe 2 is deposited in contact between source 32 and drain 34 and overlays them; being derived from a single arcuately rotated source 42 or plural fixed sources 42, 44 angled to the vertical. An insulant layer 50 of SiO, SiO 2 , AlO 2, CaF, MgF, or organic polymers of hexachlorobutadiene, divinyl benzene, aryl sulfones, fluorinated alkenyles, e.g. PTFE, or paraxylene is deposited over a portion of the semiconductor layer from single arcuately rotated source 52 or plural fixed sources 52, 54 angled to the vertical. Pad 27 is unmasked and a gate electrode 60 of, e.g. Al, Cu, Sn, Ag, Au, Pt is vapour deposited on the structure, disposed on the insulant layer between source and drain, from vertical source 62 through openings 22, 27 to form a completed FET (Fig. 12). Plural such devices may be prepared on a single substrate, which may be flexibly spooled through the vacuum chamber. Closely controlled narrow spacing is obtainable between pads 23, 25 and slot 22. The rigid substrate may be glass, sapphire, quartz, diamond, silicon carbide, aluminium, or copper and the flexible substrate may be paper, PTFE, cellulose ethers and esters, e.g. nitrite, acetate; regenerated cellulose, PVC, PVC acetate, polyvinylidene, nylon, vinyl chloride-acetate, polyimide, polyamide imide, polyethylene terephthalate, polytrifluoromenochloroethylene, or foils of Ni, Al, Cu, Sn, Ta, beryllium and ferrous base alloys, stainless steel. |
