发明名称 METHOD OF DEPOSITING METALLIC FLAKES
摘要 The present invention is directed to a method whereby thin metal flakes are deposited on a solid substrate or base. The method consists essentially in providing flakes which are very thin and relatively small and suspending them in a volatile organic liquid. The substrate is then brought into contact with the suspension in order to form a film which contains a certain number of flakes. When the substrate is removed from the suspension and the liquid is allowed to evaporate, the flakes attach themselves to the substrate by inter-molecular attraction.
申请公布号 US3713870(A) 申请公布日期 1973.01.30
申请号 USD3713870 申请日期 1970.03.06
申请人 MAAS & WALDSTEIN CO,US 发明人 KAYE M,US
分类号 B05D5/06;B44C1/14;D21H19/06;(IPC1-7):B44D1/06;B44D1/14;B44D1/02 主分类号 B05D5/06
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