| 摘要 |
The invention relates to a method for reducing the comsumption of etchants used in manufacturing semiconductor devices comprising the steps of supporting a semiconductor wafer, metering a predetermined volume of etchant onto the surface of said wafer to form a meniscus-contained body of etchant thereon, maintaining said wafer static during etching, sensing the completion of said etching, and spinning said wafer upon completion of the etching to remove the etchant from the wafer and terminate the etching operation. |
