| 摘要 |
PROBLEM TO BE SOLVED: To stably project a lead and a die pad from the back surface of a QFN package (semiconductor device) at a uniform height, to improve reliability at the time of mounting on a printed wiring board or the like, and to contribute to the improvement of a heat radiation property as well. SOLUTION: Resin 27 is filled in the opening of a lead frame 21 for the thickness thinner than the thickness of the lead frame for a prescribed thickness (d), and a semiconductor element 24 is loaded on the die pad part 22 on one surface side of the lead frame 21. The electrode of the semiconductor element and the lead on one surface side of the lead frame 21 are electrically connected by a bonding wire 25 and the semiconductor element 24, the bonding wire 25 and the lead 23 on one surface side of the lead frame 21 are sealed with sealing resin 26. |
