| 摘要 |
PROBLEM TO BE SOLVED: To cool both surfaces of a plurality of semiconductor chips, improve cooling efficiency, reduce parasitic inductance of wiring, reduce over-voltage and a loss, improve capacity of current, and improve even reliability. SOLUTION: This inverter device is constituted by providing a plurality of semiconductor elements 2 for power, a drive circuit driving a plurality of the semiconductor elements 2 for power, and a control circuit 11 controlling a plurality of the semiconductor elements 2 for power. A first metal electrode 23 is connected to an upper part of a first insulating base board 22, a plurality of semiconductor chips 191, 201 are connected to an upper part of the first metal electrode 23, a thermal buffer plate 24 is connected to an upper part of a plurality of the semiconductor chips 191, 201, a second metal electrode 25 is connected to an upper part of the thermal buffer plate 24, and a second insulating base board 26 is connected to an upper part of the second metal electrode 25. |
