| 摘要 |
A plane layer and a number of thin filamentary interconnection patterns disposed therearound are disposed on the upper surface of a flexible insulating tape. A semiconductor chip is mounted on the plane layer on the insulating tape by flip-chip bonding, and has terminals on its reverse side which are connected to the plane layer and the interconnection patterns, respectively. Some of the terminals of the semiconductor chip are connected through the plane layer to solder balls, providing ground interconnections. Other terminals are connected to the interconnection patterns to other solder balls, providing power supply interconnections. Still other terminals are connected to other interconnection patterns to still other solder balls, providing signal interconnections. The semiconductor device can simply be fabricated, requires no device hole for semiconductor chip, can be reduced in size, have electric interconnected reduced, and can have electric characteristics stabilized.
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