发明名称 |
INTERCONNECT FOR TESTING SEMICONDUCTOR DICE HAVING RAISED BOND PADS |
摘要 |
A method for testing unpackaged semiconductor dice having raised contact locations (e.g., bumped bond pads) and a method for forming an interconnect suitable for testing this type of dice are provided. The interconnect includes a substrate having contact members comprising an array of sharpened elongated projections. The sharpened projections are formed by etching (or by growing and removing an oxide) through exposed areas of a mask. A conductive layer is formed on the sharpened projections and is in electrical communication with conductive traces formed on the substrate. The conductive layer can be formed as a layer of metal, as a stack of metals including a barrier metal, as a silicide, or as a layer of polysilicon. For testing an unpackaged die, the interconnect and die are placed in a temporary carrier and biased together. The sharpened projections are adapted to penetrate the contact location on the die to a limited penetration depth to establish an ohmic connection while minimizing damage to the contact location.
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申请公布号 |
US2001050574(A1) |
申请公布日期 |
2001.12.13 |
申请号 |
US19980213573 |
申请日期 |
1998.12.17 |
申请人 |
AKRAM SALMAN;FARNWORTH WARREN M.;WOOD ALAN G. |
发明人 |
AKRAM SALMAN;FARNWORTH WARREN M.;WOOD ALAN G. |
分类号 |
G01R1/067;G01R1/073;H05K1/03;H05K3/32;H05K3/40;(IPC1-7):G01R31/26 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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