| 摘要 |
PURPOSE:To prevent leads from peeling from a package and to make it possible to prevent a reduction in the humidity resistance of a semiconductor device by a method wherein a barrier resin film is interposingly provided on the interfacial boundaries between the inner lead parts of the leads and the package. CONSTITUTION:The parts between adjacent leads 9 and 9 of each dam member 6 substantially constitute dams 6a for damming the flow of a resin and a PIQ layer 10 is interposed on the interfacial boundaries between the surfaces of inner lead parts 9a of the leads 9 and a package 14 as a barrier resin layer by forming the barrier resin layer (PIQ layer) 10 consisting of a polyimide isoindolo quinazolinedione on the surface regions of the inner lead parts 9a of the leads 9 except wire bonding parts. This layer 10 shows a good adhesion to any material for the leads 9 and the package 14, is bonded strongly to both of the leads 9 and the package 14 and has a high degree of flexibility. |
