发明名称 CUTTING AND SEPARATION OF ELECTRONIC COMPONENT LEAD
摘要 PURPOSE:To dispense with a metal mold for cutting a lead frame by a method wherein the cutting part of the lead frame is made thin to cut the cutting part of the lead frame with a laser beam and to eliminate a rise of the lead frame on the periphery of the cutting part. CONSTITUTION:The sectional area of the cutting part of a lead frame 6 is made smaller than that of other part other than the cutting part. A laser beam 15 is irradiated toward the cutting part and the cutting part is cut. At the time of cutting, the fused lead frame 6 is risen by a surface tension on the periphery of the cutting surface. However, as the cutting part is made thinner than other part other than the cutting part in advance, the cutting part does never become thicker than other part even though the lead frame 6 is risen. Thereby, a metal mold for cutting the lead frame becomes unnecessary.
申请公布号 JPH01258451(A) 申请公布日期 1989.10.16
申请号 JP19880086513 申请日期 1988.04.08
申请人 NEC CORP 发明人 KOMIYAMA TADASHI
分类号 B23K26/00;B23K26/38;H01L23/50 主分类号 B23K26/00
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