摘要 |
A header device (10) comprises; a housing (20) attached to an end face of a printed circuit board (40) having through-holes; and a plurality of pins (31 and 32) extending through and sealed to a first section (22) of the housing, the first section facing the end face of the printed circuit board. The plurality of pins (31 and 32) are arranged as an upper/lower array in a two-level structure at one surface (23) of the first section of the housing (20); the pins (32) of at least one of the two levels are bent within the first section (22) and the pins (31 and 32) of the respective level extend in the same plane out of the other surface (24) of the first section (22) of the housing (20); and the pins (31 and 32) of the respective level, which extend in the same plane, are substantially vertically bent so as to insert forward portions of the pins into the through-holes (41 and 42) of the printed circuit board(40). |