| 摘要 |
PURPOSE:To obtain the metal/polyimide composite material of flexible printed wiring board, etc., by forming the composite object which contains the polyimide constituting the insulating film with low permittivity and high heat resistance and the conductive material such as the copper with low resistance. CONSTITUTION:The surface of the flexible wiring film in which the difference of linear coefficient of thermal expansion between conductive metal and a polyimide film is at most 1.5X10<-5>, is chemically modified by plasma. Next, a plurality of said chemically decorated flexible wiring films are heated and mutually stuck through the prepreg film composed of the compound with the imide compound of 1-50%, whereby multilayer polyimide interconnection film is produced. As said polyimide film, the material composed of the imide compound which has the unit structure of formula I is preferably used. In said process of the chemical decoration by plasma, the plasma gas which contains the mixed gas of oxygen and CF4 of at least 50% is preferably used. |
