发明名称 POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad which can effect uniform pressure to a polishing agent between the polishing surface of the polishing pad and a surface to be polished of a workpiece over a wide area on the surface to be polished of the workpiece when the polishing pad is rotated around a rotary shaft passing through the center of the polishing pad in order to polish the workpiece with the use of the polishing agent. SOLUTION: The polishing surface of a polishing pad, adapted to be used for feeding the polishing agent from the center part to the peripheral part of the polishing pad, is formed therein with grooves 1 having their leading ends located in the center part 3 of the polishing surface and their trailing ends located at the outer edge 4 of the polishing surface, and having a cross-sectional area which is changed from their leading ends to the trailing ends so as to be maximum in their middle positions. With this arrangement, in the polishing part 2 of the polishing pad for polishing a workpiece, the pressure of the polishing agent can be uniformly maintained in a wide range extending from the center part to the outer peripheral part of the polishing surface.
申请公布号 JP2001121405(A) 申请公布日期 2001.05.08
申请号 JP19990302452 申请日期 1999.10.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ASAIDA YASUHIRO;YUGAWA MITSUYUKI;OKUYA NORIO
分类号 B24B37/20;B24B37/22;B24B37/26;H01L21/304 主分类号 B24B37/20
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