VERFAHREN ZUM AUSLOETEN VON AUFGEKLEBTEN SMD-BAUTEILEN.

摘要

The head is adjusted coarsely to about 20mm distance above the device (13) which is to be removed from the board. Fine adjustment in orthogonal directions brings the head directly above the device before solder-melting hot gas is directed into it. The device (13) is gripped between a centring piece (16) and a stop (17) so that shear force can be applied controllably to separate the device from the board when the solder is heated e.g. to 225 deg.C. The head may be equipped with two centring pieces and stops, forming a truncated pyramidal section with two observation windows in the top of the head.