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发明名称
ETCHING METHOD FOR SEMICONDUCTOR WAFER
摘要
申请公布号
JPH0750283(A)
申请公布日期
1995.02.21
申请号
JP19930196121
申请日期
1993.08.06
申请人
HITACHI CABLE LTD
发明人
TSUCHIYA TADAITSU
分类号
H01L21/302;H01L21/306;H01L21/3065;H01L21/338;H01L29/205;H01L29/778;H01L29/812;(IPC1-7):H01L21/306
主分类号
H01L21/302
代理机构
代理人
主权项
地址
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