SOLDERED CONNECTION FORMING EQUIPMENT,申请号JP19930193791-传众专利搜索

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发明名称	SOLDERED CONNECTION FORMING EQUIPMENT
摘要
申请公布号	JPH0750481(A)	申请公布日期	1995.02.21
申请号	JP19930193791	申请日期	1993.08.05
申请人	NEC CORP	发明人	WATANABE SHINJI
分类号	B23K1/005;H05K3/34;(IPC1-7):H05K3/34	主分类号	B23K1/005
代理机构		代理人
主权项
地址

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