| 摘要 |
<p>PROBLEM TO BE SOLVED: To orient the wafer supported on a suction pad in a prescribed direction of crystallization while removing the pollution of the wafer, with simple configuration. SOLUTION: This device has a suction pad 1 which sucks and supports a roughly disclike wafer 3 having a cut for positioning at the periphery and is driven with a drive motor 2, and a laser beam transmitter 4 and a laser beam receiver 5 arranged to catch the region of the periphery or its vicinity of a wafer 2, and a sequencer 6 obtained by the operation of the positional data corresponding to the above cut, based on the output of light reception of the laser beam receiver 5. According to the operation result, an encoder 7 controls the stop position of the drive motor 2.</p> |
