发明名称 Semiconductor device having first and second insulating layers
摘要 A semiconductor device advantageously has first and second oxidized silicon insulating layers formed on the surface of a substrate. A first oxidized silicon insulating layer is formed through a low temperature process and a second oxidized silicon insulating layer may be formed at a higher manufacturing process temperature. Advantageously, the first oxidized silicon insulating layer has a lower voltage resistance than the second oxidized silicon insulating layer.
申请公布号 US5894159(A) 申请公布日期 1999.04.13
申请号 US19970854515 申请日期 1997.05.12
申请人 SONY CORPORATION 发明人 MORI, HIROSHI;SAMESHIMA, TOSHIYUKI
分类号 H01L29/78;H01L21/28;H01L21/314;H01L21/316;H01L21/336;H01L29/49;H01L29/51;H01L29/786;(IPC1-7):H01L29/76;H01L29/94 主分类号 H01L29/78
代理机构 代理人
主权项
地址