| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. for sealing materials which. after being cured, is excellent in releasability from a metal mold and in strength of adhesion to a lead frame and which hardly stains a metal mold by using, as the release agent, a polyolefinic wax having a specified acid value. SOLUTION: The polyolefinic wax having an acid value of 100-200 is used as the release agent of an epoxy resin compsn. for sealing materials comprising an epoxy resin, a curing agent, an inorg. filler, and a release agent. 100 pts.wt. sealing resin is compounded with about 0.01-1 pt.wt. polyolefin wax having an acid value of 100-200. Any epoxy resin having at least two epoxy groups in the molecule can be used without being specifically limited. Any curing agent for an epoxy resin can be used without any specific limitation, examples being a phenolic curing agent, an amine curing sagent, and an acid anhydride. An inorg. filler can be used without any specific limitation, though crystalline silica and fused silica are pref. since they give a cured resin with a low coefficient of linear thermal expansion. |
