SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device which is mounted with a plurality of semiconductor chips. The fraction defective is low when the device is manufactured, and the efficiency of inspection is high. A method for manufacturing such a semiconductor device is also disclosed. A plurality of kinds of semiconductor chips (1) are COB-mounted on a substrate (2) and the surface of the substrate (2) mounted with the chips (1) is encapsulated with a resin (3). Then all the chips (1) mounted on the substrate (2) are inspected at once. Semiconductor devices (10) are produced by cutting the substrate (2) into pairs of adjacently arranged two different kinds of semiconductor chips (1) together which are judged to be nondefective chips.