| 摘要 |
<p>PROBLEM TO BE SOLVED: To intend the deformation avoidance of outer lead and the simplification of connection work to outer terminals when LD(laser diode) chip and a photodetector are arranged in one package for realizing the reduction of part numbers, the simplification of assembling work, the miniaturization of products, and the cost reduction. SOLUTION: An outer lead protected by the lower step parts 5b of a resin molded part with the existing electric connection parts 9b to the outer terminal effectively avoids the deformation of the outer lead ends, in the cases of cutting lead pins and handling after the fixation and manufacture of an island part 3. In such a constitution, the socket parts 12 wherein the electric connection surfaces 9b of the outer lead are exposed are formed on the protruding parts on the lower surface side, so that the socket parts 12 may be inserted into a continuity tester and a socket loading part, etc., for facilitating the electric connection between respective lead pins and the outer terminals.</p> |
