| 摘要 |
<p>In a data carrier (1) having a module (4) implanted in a trough-shaped recess (3) after this has been formed, the carrier/contact configuration (5) of the implanted module (4) has been manufactured with the aid of a metal lead frame and the module (4) has a chip cover (7) of a double-sided construction in relation to the carrier/contact configuration (5), the outer part (60) of this chip cover serving for the electrical insulation of the module (4).</p> |
