发明名称 Surface mount conductive polymer devices and methods for manufacturing such devices
摘要 <p>A surface mounted conductive polymer device has an active element, comprising a layer (76) of conductive polymeric material sandwiched between first and second conductive electrode layers (78 & 80). A first thermal lead (82a) has a first juncture with the first electrode layer (78) while a second terminal lead (82b) has a second juncture with the second electrode layer (80). An insulative package (86) encloses the active element and the first and second junctures. <IMAGE></p>
申请公布号 EP0953992(A1) 申请公布日期 1999.11.03
申请号 EP19990201267 申请日期 1996.08.14
申请人 BOURNS MULTIFUSE (HONG KONG), LTD. 发明人 HOGGE, STEVEN DARRYL;ZHANG, MENGRUO;STRAKER, GARY;GRATZINGER, PAUL G.;WISNER, DUANE
分类号 B29C47/92;B32B37/15;H01C1/028;H01C1/034;H01C1/14;H01C7/02;H01C17/28;H01L51/10;H01L51/40;H01R43/00;(IPC1-7):H01C7/02 主分类号 B29C47/92
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