发明名称 |
Surface mount conductive polymer devices and methods for manufacturing such devices |
摘要 |
<p>A surface mounted conductive polymer device has an active element, comprising a layer (76) of conductive polymeric material sandwiched between first and second conductive electrode layers (78 & 80). A first thermal lead (82a) has a first juncture with the first electrode layer (78) while a second terminal lead (82b) has a second juncture with the second electrode layer (80). An insulative package (86) encloses the active element and the first and second junctures. <IMAGE></p> |
申请公布号 |
EP0953992(A1) |
申请公布日期 |
1999.11.03 |
申请号 |
EP19990201267 |
申请日期 |
1996.08.14 |
申请人 |
BOURNS MULTIFUSE (HONG KONG), LTD. |
发明人 |
HOGGE, STEVEN DARRYL;ZHANG, MENGRUO;STRAKER, GARY;GRATZINGER, PAUL G.;WISNER, DUANE |
分类号 |
B29C47/92;B32B37/15;H01C1/028;H01C1/034;H01C1/14;H01C7/02;H01C17/28;H01L51/10;H01L51/40;H01R43/00;(IPC1-7):H01C7/02 |
主分类号 |
B29C47/92 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|