发明名称 Method of forming a capacitor
摘要 A method of forming a capacitor includes, a) providing a node to which electrical connection to a capacitor is to be made; b) providing an electrically conductive first layer over the node; c) providing an electrically insulative barrier second layer over the first conductive layer; d) providing a third layer over the electrically insulative barrier layer, the third layer comprising a material which is either electrically conductive and resistant to oxidation, or forms an electrically conductive material upon oxidation; e) providing an insulating inorganic metal oxide dielectric layer over the electrically conductive third layer; f) providing an electrically conductive fourth layer over the insulating inorganic metal oxide dielectric layer; and g) providing an electrically conductive interconnect to extend over the second insulative layer and electrically interconnect the first and third conductive layers. A capacitor construction having such a dielectric layer in combination with the barrier layer and electrical interconnect of a first capacitor plate is disclosed.
申请公布号 US5985714(A) 申请公布日期 1999.11.16
申请号 US19970858027 申请日期 1997.05.16
申请人 MICRON TECHNOLOGY, INC. 发明人 SANDHU, GURTEJ S.;SCHUELE, PAUL;KINNEY, WAYNE
分类号 H01L21/02;H01L21/8242;H01L21/8246;(IPC1-7):H01L21/824 主分类号 H01L21/02
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