| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of uniformly polishing a wafer, and provide a manufacturing method of a semi-conductor device employing the polishing device. SOLUTION: This polishing device is provided with a carrier for letting a wafer be rotated while being held, a polishing turntable disposed so as to be faced to the carrier, a rotating shaft for letting the polishing turntable be eccentrically rotated, a plurality of pressing parts 14 disposed over the polishing turntable, pressurizing pipelines 15 connected to the plurality of the pressing parts 14 respectively, and with a slurry feeding means 16 feeding slurry out of each gap between the pressing parts 14. By this constitution, the wafer can be polished uniformly. |
