| 摘要 |
PROBLEM TO BE SOLVED: To carry out a two steps of polishing at a high speed as much as possible, by a plane polishing device for general purpose. SOLUTION: Around the first arm shaft 51, and the second arm shaft 51a coaxiall with the first arm shaft, four wafer heads 53a to 53d are provided in the hanging-down form, at the same radial positions at both sides of rotary arms 52 and 52a which are rotatable respectively, and at the positions responding to the arrangement radius of the wafer heads, at the angular positions surrounsing the first and the second arm shafts, four rotary platens 56a to 56d, and four washing bathes 55a to 55d at the same angular positions between them respectively, are provided. The wafer heads can move up and down to the both rotary arms, and they such a wafer 54 to the rotary platens by adsorbing and holding it at the lower surface and carry out the polishing by autorotating. The washing bathes have the function of a transfer station concurrently, and the wafer is replaced to ride on at the transfer station. |
