发明名称 DIELECTRIC SUBSTANCE FOR INTEGRATED CIRCUIT AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To improve the mechanical strength of a xerogel layer by moving most of the polymer material outward from the minimum gap between adjacent lines connected to each other while the xerogel layer is formed, by giving phase separation to the xerogel and generating an air gap below the xerogel layer as an intermediate-level dielectric substance in a mutually connected multistage integrated circuit. SOLUTION: A polymer material, the surface of which is coated with a liner 140, is coated with a solution prepared by adding a xerogel precursor solution consisting of a hydrolyzed TEOS monomer, oligomer condensed from water, tetraethylene glycol(TEG), and an acid to an ethanol solvent while the substance is rotated. Then an oilgomer-water-TEG layer and a minimum gap containing only the TEG are formed by evaporating the ethanol solvent. Thereafter, xerogel composed of a network polymer is formed by aging. When the xerogel is dried, a xerogel layer 144 is formed on an unfilled minimum gap 143. Therefore, the mechanical strength of the xerogel layer can be improved in a bulk area due to the manufacturing workability.
申请公布号 JP2000091330(A) 申请公布日期 2000.03.31
申请号 JP19990148665 申请日期 1999.05.27
申请人 TEXAS INSTR INC <TI> 发明人 JIN CHANGMING;JOSEPH D RUTOMAA
分类号 H01L21/768;H01L21/283;H01L21/312;H01L21/316;H01L23/522 主分类号 H01L21/768
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