| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode terminal junction ceramic member for semiconductor manufacturing device, such as a wafer-holding body or shower head which is reduced in thickness by using a metallized layer of a high-melting point metal as a heater wiring, an electrode for electrostatic chuck, etc., and in which an electrode terminal is junctioned directly to the metallized layer, without having to use a brazing material solder. SOLUTION: The electrode terminal 3, made of a high-melting point metal, is junctioned directly to the metallized layer 2 of the high-melting point metal, formed on a ceramic substrate 1 by applying paste of the powder of the high- melting point metal, containing metal oxide powder to the surface of the substrate 1 or a molded body of ceramic powder and baking the paste, while one end of the terminal 3 is inserted into the paste. On the other end of the terminal 3, a screw structure, such as a male screw 3a, etc., can be formed for the connection with an external wiring 7.
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