摘要 |
PROBLEM TO BE SOLVED: To provide a release sheet for a semiconductor mold or particularly the release sheet capable of easily releasing a mold without using a mold structure or a mold release agent, when the mold is taken out from the mold without generating a wrinkle on the mold, in the sheet for simultaneously molding a package of a state in which a rear surface of a semiconductor chip is bare. SOLUTION: The mold release sheet for the semiconductor mold comprises a layer (layer A) for bearing mold releasability from the mold, and a layer (layer B) for bearing a heat resistance against heating at molding two layers. In this case, a release force from the mold is preferably 0 to 0.5 N/25 mm.
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