发明名称 MOLD RELEASE SHEET FOR SEMICONDUCTOR MOLD AND METHOD FOR MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a release sheet for a semiconductor mold or particularly the release sheet capable of easily releasing a mold without using a mold structure or a mold release agent, when the mold is taken out from the mold without generating a wrinkle on the mold, in the sheet for simultaneously molding a package of a state in which a rear surface of a semiconductor chip is bare. SOLUTION: The mold release sheet for the semiconductor mold comprises a layer (layer A) for bearing mold releasability from the mold, and a layer (layer B) for bearing a heat resistance against heating at molding two layers. In this case, a release force from the mold is preferably 0 to 0.5 N/25 mm.
申请公布号 JP2002158242(A) 申请公布日期 2002.05.31
申请号 JP20000358677 申请日期 2000.11.27
申请人 HITACHI CHEM CO LTD 发明人 YAMAMOTO OSAMU;OYAMA YASUSHI;HIROSE AKIRA;NAKAYAMA YOSHIHIRO
分类号 B32B7/06;B29C45/02;B32B27/00;B32B27/30;H01L21/56;(IPC1-7):H01L21/56 主分类号 B32B7/06
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