BOARD FOR MOUNTING IC, ITS MANUFACTURING METHOD AND METHOD FOR MOUNTING IC THEREON

摘要

PROBLEM TO BE SOLVED: To enable simple mounting of an IC with high reliability. SOLUTION: A method for manufacturing a board for mounting the IC comprises the steps of covering the surface of a protrusion 11 provided on a surface of a base 10 with a conductive metal layer 12 which is a circuit pattern to form a bump 2 of an IC-mounting terminal. The protrusion 11 is formed of a material more flexible than the base 10. Even the smallest applied pressure necessary at the mounting time of the IC 3 absorbs at least dispersion in the heights of the bumps 2, to surely connect the bumps.