| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which improves the efficiency of mounting semiconductor packages on a printed circuit board and omits the semiconductor manufacturing steps after molding to reduce the cost. SOLUTION: A lead frame 10 has inner leads 11a, 12a and outer leads 11b, 12b formed such that the length from the bonding parts of the inner lead to the end of the outer lead is short. After molding the lead frame and semiconductor chip 3 with a molding resin 8, the ends of the outer leads 11b, 12b are exposed at the bottom face of the resin 8, without having these leads protrude out from the resin 8. |
