| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a thermal stress which is applied to an IC chip carried by a die bonding material on a heatsink as much as possible in a resin mold package type semiconductor apparatus. <P>SOLUTION: The semiconductor apparatus S1 includes the heatsink 10; the IC chip 20 carried on the heatsink 10 through the die bonding material 30; a lead frame 40 disposed around the IC chip 20 and electrically connected to the IC chip 20; and the mold resin 60 which seals so that the IC chip 20, the heatsink 10, and the lead frame 40 may be wrapped in. In the semiconductor apparatus S1, the upper end side of the die bonding material 30 is lower than the upper surface of the IC chip 20 in the state with the distance t1 of 0.1 mm or more preferably between the upper surface of the IC chip 20 and the upper end surface of the die bonding material 30 in the end surface of the IC chip 20. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
