| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that in a mounting structure using a solder adhesive comprising solder particles and a thermoplastic resin, bond strength of the solder particles and the thermoplastic resin or the thermoplastic resin and a substrate is low, and durability is not excellent. SOLUTION: A silane coupling agent is added to the solder adhesive comprising solder particles and a thermoplastic resin so as to obtain a solder adhesive of high bonding strength. The mounting structure 1, is which an electric component and an electrode or a substrate are firmly bonded, is obtained by: coating the solder adhesive containing the silane coupling agent on a pattern printed electrode 3 on the substrate 2; disposing the electric component 4 thereon to be heated; forming a solder layer 5 by the molten solder particles; and forming a resin layer 6 at the periphery thereof by the thermoplastic resin. COPYRIGHT: (C)2007,JPO&INPIT |
