发明名称 |
Semiconductor package accomplishing fan-out structure through wire bonding |
摘要 |
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can be easily stacked on another semiconductor package while the appearance cracks and the warpage defects can be prevented.
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申请公布号 |
US7327032(B2) |
申请公布日期 |
2008.02.05 |
申请号 |
US20060279344 |
申请日期 |
2006.04.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOON TAE-SUNG |
分类号 |
H01L23/48;H01L23/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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