| 摘要 |
A light module and a method of forming the module are disclosed. The light module includes a plurality of light units and a module substrate having a patterned circuit layer on a first surface of the module substrate and a plurality of openings for accommodating the light units. Each light unit includes a metal substrate, a plurality of light emitting diode (LED) chips mounted on a first surface of the metal substrate, a plurality of conductive layers for respectively connecting a positive terminal and a negative terminal of each LED to the patterned circuit layer, an insulating layer on the metal substrate for separating the plurality of conductive layers from the metal substrate; and a bearing layer formed above the metal substrate, and configured to support the module substrate and the optical lens.
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