发明名称 TAPBONDER STRUCTURE FOR THERMOCOMPRESSION BONDING TOOL AND TAB BONDING PROCESS
摘要 A structure of a backup tool for a thermo-compression tool and a tap bonding process are provided to compensate that a tool tip is non-uniformly heated by a heater by varying the structure of the backup tool for supporting a substrate, thereby providing uniform temperature and pressure to the substrate and improving the attachment efficiency of an anisotropic conductive film used for tap bonding. A tip housing(54) has a heater within it. A tool tip(58) is installed in the bottom of the tip housing, and presses a tap at predetermined temperature and pressure to be attached. A backup tool(62) is installed as being spaced from the tool tip as much as a predetermined distance to support a substrate. By the backup tool, the pressure generate when the tool tip presses the tap is uniformed over the whole tool tip. If the tool tip is bent by non-uniform heating of a heater(56), a backup tool piece(64) is rotated. Therefore, the backup tool piece uniforms temperature and pressure non-uniformly distributed by the transformation of the tool tip.
申请公布号 KR20080032412(A) 申请公布日期 2008.04.15
申请号 KR20060098089 申请日期 2006.10.09
申请人 LG ELECTRONICS INC. 发明人 SONG, KI HOON;KIM, TAE WON;SHIN, JEONG HO;PARK, JONG HOON
分类号 G02F1/1345;G02F1/13 主分类号 G02F1/1345
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