| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To effectively enhance a standoff in an electronic device equipped with electronic components having solder connecting pads on their lower surface, and a printed wiring board having pads solder-jointed with the pads on the lower surface of the electronic components at positions on the surface of the board opposing to the pads on the lower surface of the electronic components. <P>SOLUTION: On one surface of the lower surface of the electronic components 60, 70 and the surface 51 of the printed wiring board 50, dummy pads 501, 702 are provided at positions on the one surface opposing to positions on the other surface where no pads are provided. Then, solder grains 403, 405 are connected with the dummy pads 501, 702, and contacted with the other surface. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
