| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder material flow out preventing structure which prevents the flowing out of a solder material, which does not inhibit wire bonding and the mounting of a component after soldering, and which is excellent in terms of mounting property. <P>SOLUTION: An electronic component 5 is fixed with a solder material 4 by use of the solder material 4 in a state in which the electronic component crosses over a conductor pad 13 of an component mounting portion. Then, a solder flow out preventing portion 8 for preventing the solder material from flowing out to a wire bonding pad 7 is provided in order to connect a wire 6 using a wire bonding pad 14. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
