| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which reliably removes a flux residue from a solder resist of a substrate. <P>SOLUTION: The method of manufacturing a semiconductor device comprises steps of: providing a photoresist 13 on a solder resist 121; applying a flux on a substrate 12; joining joints 122 of the substrate 12 and a semiconductor element 11 by soldering; and removing the flux and the photoresist 13 to expose the solder resist 121. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
